Author(s): Anita D. Thakur, J. N. Sharma

Email(s): anitanithamirpur@yahoo.com , jnsnith@gmail.com

DOI: Not Available

Address: Anita D. Thakur1* and J. N. Sharma2
1G.M.S. Sadoh u/c G.S.S.S. Baryara, Mandi, Himachal Pradesh, India
2Department of Mathematics, National Institute of Technology, Hamirpur, India
*Corresponding Author

Published In:   Volume - 5,      Issue - 1,     Year - 2013


ABSTRACT:
The aim of this paper is to study the disturbances in a homogeneous, transversely isotropic (6mm class), linear generalized piezothermoelastic rectangular continuum subjected to continuous temperature input The aim of this paper is to study the disturbances in a homogeneous, transversely isotropic due to impact and continuous strip thermal sources, temperature or temperature gradient input acting on the rigidly fixed and charge free(open circuit) surface of a homogeneous, transversely isotropic, thermally conducting, generalized piezothermoelastic half-space. The Laplace and Fourier transforms technique have been employed to solve the model consisting of partial differential equations and boundary conditions in the transformed domain. In order to obtain the results in the physical domain the quadratic complex polynomial characteristic equation corresponding to the associated system of coupled ordinary differential equations has been solved by using DesCartes’ algorithm with the help of irreducible Cardano’s method. The inverse transform integrals are evaluated by using numerical technique consisting of Fourier series approximation and Romberg integration. The temperature change, stresses and electric potential so obtained in the physical domain are computed numerically and presented graphically for cadmium selenide (CdSe) material. The study may find applications in smart structures, piezoelectric filters, resonators, transducers, sensing devices and vibration control.


Cite this article:
Anita D. Thakur, J. N. Sharma. Generalized Piezothermoelastic Continuum Subjected To Temperature Input. Research J. Science and Tech 5(1): Jan.-Mar.2013 page 207-212.


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